Description
[Pre-Order]
JP Available Month: December 2026
Estimate US Available Month: January - March 2027
- Estimate Shipping Date might be changed
* US release date is usually 2-3 months later than JP release date
* Orders includes pre-order items will be shipped once all items become available.
* PLEASE see and agree with the Shipping Policy
Bandai Hobby Mobile Suite Gundam Model Kit
• The Gunpla HG series has been completely renewed to coincide with the HD remaster of Mobile Suit Gundam SEED.
• Newly included attachment parts allow the model to connect to Action Base 2 (sold separately), making it possible to recreate dynamic action poses characteristic of the SEED series.
• New marking stickers are included for added detail and customization.
• The packaging design has been revamped.
• The molded colors have been updated to more faithfully reproduce the colors seen in the anime.
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